DocumentCode :
164789
Title :
Panel discussions: Toward wearable computing era, how COOL chip architecture and tools will evolve?
Author :
Arakawa, Fumio
Author_Institution :
Nagoya University, Japan
fYear :
2014
fDate :
14-16 April 2014
Firstpage :
1
Lastpage :
2
Abstract :
Now we are enjoying the mobile computing era mainly with smart phones. This is a fruit of the continuous downsizing of computing devices, and further downsizing will realize a wearable computing era. Some wearable devices have been already available or announced today, and the shift to the new era is ongoing. We can enjoy a network infrastructure in many situations, although its speed, response time, or dependability is not always enough, and cloud computing is now popular approach to get extra computing power for client devices. So, we must consider how and from where we should get computing power to realize a good wearable computing device that will make new application enjoyable. An embedded processor of the device should have the features tuned for the device and different from that of a mobile device, and low power is one of the key features. Under such backgrounds, we will discuss how COOL chip architectures and tools will evolve toward wearable computing era.
Keywords :
Abstracts; Computer architecture; Educational institutions; Microprocessors; Mobile computing; Smart phones; Wearable computers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
COOL Chips XVII, 2014 IEEE
Conference_Location :
Yokohama, Japan
Type :
conf
DOI :
10.1109/CoolChips.2014.6842948
Filename :
6842948
Link To Document :
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