Signal integrity evaluation of a 10 Gbits/sec optoelectronic interconnect

Signal integrity is of vital importance to high speed interconnects. The 10G system is a 10 Gbit/second optical interconnect with a cross-section bandwidth of over 1T bit/second fabricated on a heterogeneous platform consisting of a multi-chip module, high-speed SiGe and GaAs opto-electronics. We compare lumped and multisegment microstrip models of the transmission lines on the MCM hybrid. We also model the wirebonds using a quasi-static model and a Co-Planar Waveguide (CPW) model for the bump bonds between the GaAs and SiGe substrates. These models are utilized by a behavioral simulator to demonstrate the effects of interconnect components on waveform shape. The results demonstrate convincingly that signal integrity is of critical importance to end-to-end performance measures at high transmission speeds and that incorporating these models is important to behavioral simulation.