Title :
Layer Minimization of Escape Routing in Area Array Packaging
Author :
Wang, Renshen ; Shi, Rui ; Cheng, Chung-Kuan
Author_Institution :
Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA
Abstract :
We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach
Keywords :
network routing; packaging; area array packaging; central triangular sequence; escape routing layers; layer minimization; network flow model; Chip scale packaging; Computer science; Costs; Integrated circuit interconnections; Minimization; Nonhomogeneous media; Permission; Pins; Routing; Wires; Escape routing; bottleneck analysis; central triangular pattern;
Conference_Titel :
Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
1-59593-389-1
Electronic_ISBN :
1092-3152
DOI :
10.1109/ICCAD.2006.320125