• DocumentCode
    1649168
  • Title

    Layer Minimization of Escape Routing in Area Array Packaging

  • Author

    Wang, Renshen ; Shi, Rui ; Cheng, Chung-Kuan

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA
  • fYear
    2006
  • Firstpage
    815
  • Lastpage
    819
  • Abstract
    We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach
  • Keywords
    network routing; packaging; area array packaging; central triangular sequence; escape routing layers; layer minimization; network flow model; Chip scale packaging; Computer science; Costs; Integrated circuit interconnections; Minimization; Nonhomogeneous media; Permission; Pins; Routing; Wires; Escape routing; bottleneck analysis; central triangular pattern;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    1-59593-389-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2006.320125
  • Filename
    4110127