DocumentCode
1649168
Title
Layer Minimization of Escape Routing in Area Array Packaging
Author
Wang, Renshen ; Shi, Rui ; Cheng, Chung-Kuan
Author_Institution
Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA
fYear
2006
Firstpage
815
Lastpage
819
Abstract
We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach
Keywords
network routing; packaging; area array packaging; central triangular sequence; escape routing layers; layer minimization; network flow model; Chip scale packaging; Computer science; Costs; Integrated circuit interconnections; Minimization; Nonhomogeneous media; Permission; Pins; Routing; Wires; Escape routing; bottleneck analysis; central triangular pattern;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
1-59593-389-1
Electronic_ISBN
1092-3152
Type
conf
DOI
10.1109/ICCAD.2006.320125
Filename
4110127
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