• DocumentCode
    1649606
  • Title

    On the differences between ultra-fast NBTI measurements and Reaction-Diffusion theory

  • Author

    Islam, A.E. ; Mahapatra, S. ; Deora, S. ; Maheta, V.D. ; Alam, M.A.

  • Author_Institution
    Dept. of ECE, Purdue Univ., West Lafayette, IN, USA
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Reaction-Diffusion (R-D) theory, well-known to successfully explain most features of NBTI stress, is perceived to fail in explaining NBTI recovery. Several efforts have been made to understand differences between NBTI relaxation measured using ultra-fast methods and that predicted by R-D theory. Many alternative theories have also been proposed to explain ultra-fast NBTI relaxation, although their ability in predicting features of NBTI stress remains questionable. In this work, a hole-trap/interface-trap (NHT/NIT) separation framework (Fig. 1a) is used to demonstrate that NIT relaxes slower compared to overall NBTI and this NIT relaxation is consistent with R-D theory. The framework also explains, perhaps for the first time, the observed impacts of nitrogen, stress-time, temperature, frequency, duty cycle, etc. on NBTI degradation. In sum, together with NHT, the R-D model governing NIT is shown to explain NBTI stress and recovery features in nitrided gate oxide p-MOSFETs.
  • Keywords
    MOSFET; high-speed techniques; semiconductor device measurement; NBTI relaxation; hole-trap/interface-trap separation framework; negative bias temperature instability; nitrided gate oxide p-MOSFET; reaction-diffusion theory; ultrafast NBTI measurements; Acceleration; Degradation; Dielectrics; Frequency; MOSFET circuits; Niobium compounds; Nitrogen; Stress; Temperature; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2009 IEEE International
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4244-5639-0
  • Electronic_ISBN
    978-1-4244-5640-6
  • Type

    conf

  • DOI
    10.1109/IEDM.2009.5424236
  • Filename
    5424236