• DocumentCode
    1650279
  • Title

    Impact of via-line contact on CU interconnect electromigration performance

  • Author

    Li, Baozhen ; Gill, Jason ; Christiansen, Cathryn J. ; Sullivan, Timothy D. ; McLaughlin, Paul S.

  • Author_Institution
    IBM Syst. & Technol. Group, Essex Junction, VT, USA
  • fYear
    2005
  • Firstpage
    24
  • Lastpage
    30
  • Keywords
    copper; electromigration; integrated circuit interconnections; integrated circuit reliability; redundancy; voids (solid); Cu; copper/top cap layer interface; damascene processing; interconnect electromigration; line depletion; line extension; open-circuit failures; redundant vias; via depletion; via liner quality; via-line contact effects; via/line contact configurations; voiding; Adhesives; Contact resistance; Copper; Electromigration; Electrons; Failure analysis; Joining processes; Redundancy; Shape; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493056
  • Filename
    1493056
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1650279