• DocumentCode
    1650320
  • Title

    Stress migration and the mechanical properties of copper

  • Author

    Alers, Glenn B. ; Sukamto, J. ; Woytowitz, P. ; Lu, X. ; Kailasam, S. ; Reid, J.

  • Author_Institution
    Novellus Syst. Inc., San Jose, CA, USA
  • fYear
    2005
  • Firstpage
    36
  • Lastpage
    40
  • Keywords
    copper; electroplating; integrated circuit interconnections; stress effects; tensile strength; copper thickness; dual damascene copper interconnects; elastic versus plastic energy dissipation; mechanical properties; plating chemistry; stress migration; tensile stress; Annealing; Argon; Chemistry; Copper; Dielectrics; Kelvin; Mechanical factors; Tensile stress; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493058
  • Filename
    1493058
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1650320