• DocumentCode
    1650439
  • Title

    A High-Quality Mixed-Size Analytical Placer Considering Preplaced Blocks and Density Constraints

  • Author

    Chen, Tung-Chieh ; Jiang, Zhe-Wei ; Hsu, Tien-Chang ; Chen, Hsin-Chen ; Chang, Yao-Wen

  • Author_Institution
    Graduate Inst. of Electron. Eng., National Taiwan Univ., Taipei
  • fYear
    2006
  • Firstpage
    187
  • Lastpage
    192
  • Abstract
    In addition to wirelength, modern placers need to consider various constraints such as preplaced blocks and density. We propose a high-quality analytical placement algorithm considering wirelength, preplaced blocks, and density based on the log-sum-exp wirelength model proposed by Naylor et al. (2001) and the multilevel framework. To handle preplaced blocks, we use a two-stage smoothing technique, Gaussian smoothing followed by level smoothing, to facilitate block spreading during global placement. The density is controlled by white-space re-allocation using partitioning and cut-line shifting during global placement and cell sliding during detailed placement. We further use the conjugate gradient method with dynamic step-size control to speed up the global placement and macro shifting to find better macro positions. Experimental results show that our placer obtains the best published results
  • Keywords
    Gaussian processes; integrated circuit design; Gaussian smoothing; block spreading; cell sliding; cut-line shifting; density constraints; global placement; high-quality analytical placement algorithm; high-quality mixed-size analytical placer; log-sum-exp wirelength model; preplaced blocks; two-stage smoothing technique; white-space reallocation; Algorithm design and analysis; Gradient methods; Law; Legal factors; Minimization methods; Routing; Runtime; Sliding mode control; Smoothing methods; White spaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    1-59593-389-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2006.320084
  • Filename
    4110172