DocumentCode :
1651048
Title :
Highly scalable nonvolatile TiOx/TaSiOy solid-electrolyte crossbar switch integrated in local interconnect for low power reconfigurable logic
Author :
Tada, M. ; Sakamoto, T. ; Tsuji, Y. ; Banno, N. ; Saito, Y. ; Yabe, Y. ; Ishida, S. ; Terai, M. ; Kotsuji, S. ; Iguchi, N. ; Aono, M. ; Hada, H. ; Kasai, N.
Author_Institution :
Device Platforms Res. Labs., NEC Corp., Sagamihara, Japan
fYear :
2009
Firstpage :
1
Lastpage :
4
Abstract :
A fully logic-compatible, nonvolatile crossbar switch using a novel dual-layer TiOx/TaSiOy solid-electrolyte, ¿NanoBridge¿, has been developed for the first time, which is scalable to 50 nm and beyond and keeps the extremely low ON-resistance of <100 ¿. A key breakthrough is the dual-layer solid-electrolyte, in which TiOx works as an oxygen absorber as well as a superior ionic conductor, thus improving the yield, ON/OFF resistance ratio (>106) and cycling endurance (>103). The highly scalable 4 × 4 crossbar switch composed of NanoBridge integrated in a local Cu interconnect of a standard CMOS is successfully configured without select transistors. The nonvolatile solid-electrolyte, crossbar switch is a promising switch element for low power and low cost reconfigurable logic.
Keywords :
CMOS integrated circuits; copper; integrated circuit interconnections; logic devices; low-power electronics; solid electrolytes; switches; CMOS; Cu interconnect; ON/OFF resistance ratio; TiO-TaSiO; cycling endurance; dual-layer solid-electrolyte; low power reconfigurable logic; nanobridge; nonvolatile crossbar switch; nonvolatile solid-electrolyte crossbar switch; oxygen absorber; size 50 nm; superior ionic conductor; switch element; Bridge circuits; Electrodes; Energy consumption; Nanoscale devices; Oxidation; Reconfigurable logic; Solids; Switches; Ultra large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4244-5639-0
Electronic_ISBN :
978-1-4244-5640-6
Type :
conf
DOI :
10.1109/IEDM.2009.5424287
Filename :
5424287
Link To Document :
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