Title :
High speed parallel data transmission modules for optical data links
Author :
Shao, Z. ; Keller, C. ; Uchida, T.K.
Author_Institution :
Optobahn Corp., Torrance, CA, USA
Abstract :
A silicon bipolar chipset for use in a 15 Gbps optical link is presented. This parallel (multichannel) optical interconnect module provides an ideal solution to high speed communication. Three main technologies (lasers, silicon bipolar ICs, and packaging) used to achieve this high performance link are also discussed.
Keywords :
bipolar integrated circuits; data communication; integrated circuit packaging; modules; optical communication equipment; optical fibre communication; optical interconnections; optical links; semiconductor laser arrays; 15 Gbit/s; GaAsP-InP; InGaAs; Si; high performance link; high speed communication; high speed parallel data transmission modules; laser array; laser diodes; multichannel optical interconnect module; optical data links; packaging; silicon bipolar IC; silicon bipolar chipset; Bandwidth; Data communication; High speed optical techniques; Optical fiber communication; Optical interconnections; Optical receivers; Optical transmitters; Semiconductor laser arrays; Surface emitting lasers; Vertical cavity surface emitting lasers;
Conference_Titel :
Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference
Conference_Location :
Beijing, China
Print_ISBN :
7-5635-0402-8
DOI :
10.1109/APCC.1999.824562
