High speed parallel data transmission modules for optical data links

Author

Shao, Z. ; Keller, C. ; Uchida, T.K.

Author_Institution

Optobahn Corp., Torrance, CA, USA

Volume

1

fYear

1999

Firstpage

394

Abstract

A silicon bipolar chipset for use in a 15 Gbps optical link is presented. This parallel (multichannel) optical interconnect module provides an ideal solution to high speed communication. Three main technologies (lasers, silicon bipolar ICs, and packaging) used to achieve this high performance link are also discussed.

Keywords

bipolar integrated circuits; data communication; integrated circuit packaging; modules; optical communication equipment; optical fibre communication; optical interconnections; optical links; semiconductor laser arrays; 15 Gbit/s; GaAsP-InP; InGaAs; Si; high performance link; high speed communication; high speed parallel data transmission modules; laser array; laser diodes; multichannel optical interconnect module; optical data links; packaging; silicon bipolar IC; silicon bipolar chipset; Bandwidth; Data communication; High speed optical techniques; Optical fiber communication; Optical interconnections; Optical receivers; Optical transmitters; Semiconductor laser arrays; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference

Conference_Location

Beijing, China

Print_ISBN

7-5635-0402-8

Type

conf

DOI

10.1109/APCC.1999.824562

Filename

824562