Title :
AFRA: A low cost high performance reliable routing for 3D mesh NoCs
Author :
Akbari, Sara ; Shafiee, Ali ; Fathy, Mahmoud ; Berangi, Reza
Author_Institution :
Sch. of Comput. Eng., Univ. of Sci. & Technol., Iran
Abstract :
Three-dimensional network-on-chips are suitable communication fabrics for high-density 3D many-core ICs. Such networks have shorter communication hop count, compared to 2D NoCs, and enjoy fast and power efficient TSV wires in vertical links. Unfortunately, the fabrication process of TSV connections has not matured yet, which results in poor vertical links yield. In this work, we address this challenge and introduce AFRA, a deadlock-free routing algorithm for 3D mesh-based NoCs that tolerates faults on vertical links. AFRA is designed to be simple, high performance, and robust. The simplicity is achieved by applying ZXY and XZXY routings in the absence and presence of fault, respectively. Furthermore, AFRA, as will be proved, is deadlock-free when all vertical faulty links have the same direction. This enables the routing to save virtual channels for performance rather than scarifying them for deadlock avoidance. Finally, AFRA provides robustness, which means supporting connection for all possible pairs of communicating nodes in high fault rates. AFRA is evaluated, though cycle accurate network simulation, and is compared with planar adaptive routing. Results reveal that AFRA significantly outperforms planar adaptive routing in both synthetic and real traffic patterns. In addition, the robustness of AFRA is calculated analytically.
Keywords :
network routing; network-on-chip; three-dimensional integrated circuits; wires; 2D NoC; 3D mesh NoC; AFRA; XZXY routings; cycle accurate network simulation; fault rates; high-density 3D many-core IC; low cost high performance reliable routing; planar adaptive routing; power efficient TSV wires; three-dimensional mesh network-on-chips; vertical links; virtual channels; Adaptation models; Circuit faults; Reliability; Routing; System recovery; Three dimensional displays; Through-silicon vias;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2012
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-2145-8
DOI :
10.1109/DATE.2012.6176490