• DocumentCode
    1651494
  • Title

    Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low K technologies

  • Author

    Wu, Huixian ; Archer, Vance ; Merchant, Sailesh M. ; Cargo, James ; Chesire, Daniel ; Antol, Joze ; Mengel, Rafe ; Osenbach, John ; Horvat, Steve ; Peridier, Carl ; White, Marvin

  • Author_Institution
    Agere Syst., Allentown, PA, USA
  • fYear
    2005
  • Firstpage
    286
  • Lastpage
    293
  • Keywords
    copper; dielectric thin films; etching; failure analysis; fluoride glasses; focused ion beam technology; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; microassembling; polishing; scanning electron microscopy; CMP; CUP structures; Cu; FIB; FSG; RIE; SEM; assembly reliability; backside cross-section techniques; backside deprocessing techniques; chemical mechanical polishing; circuit-under-pad structures; defect localization; failure analysis; fluorine silica glass; focused ion beam; low-k dielectrics; package reliability; parallel polishing; reactive ion etching; scanning electron microscopy; wet chemical etching; Assembly; Bonding; Chemical technology; Copper; Fabrication; Failure analysis; Integrated circuit technology; Packaging; Scanning electron microscopy; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493100
  • Filename
    1493100
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1651494