1651494

Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low K technologies

Wu, Huixian ; Archer, Vance ; Merchant, Sailesh M. ; Cargo, James ; Chesire, Daniel ; Antol, Joze ; Mengel, Rafe ; Osenbach, John ; Horvat, Steve ; Peridier, Carl ; White, Marvin

Agere Syst., Allentown, PA, USA

2005

286

293

copper; dielectric thin films; etching; failure analysis; fluoride glasses; focused ion beam technology; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; microassembling; polishing; scanning electron microscopy; CMP; CUP structures; Cu; FIB; FSG; RIE; SEM; assembly reliability; backside cross-section techniques; backside deprocessing techniques; chemical mechanical polishing; circuit-under-pad structures; defect localization; failure analysis; fluorine silica glass; focused ion beam; low-k dielectrics; package reliability; parallel polishing; reactive ion etching; scanning electron microscopy; wet chemical etching; Assembly; Bonding; Chemical technology; Copper; Fabrication; Failure analysis; Integrated circuit technology; Packaging; Scanning electron microscopy; Wet etching;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493100

1493100