• DocumentCode
    1651858
  • Title

    Wire Density Driven Global Routing for CMP Variation and Timing

  • Author

    Cho, Minsik ; Pan, David Z. ; Xiang, Hua ; Puri, Ruchir

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX
  • fYear
    2006
  • Firstpage
    487
  • Lastpage
    492
  • Abstract
    In this paper, we propose the first wire density driven global routing that considers CMP variation and timing. To enable CMP awareness during global routing, we propose a compact predictive CMP model with dummy fill, and validate it with extensive industry data. While wire density has some correlation and similarity to the conventional congestion metric, they are indeed different in the global routing context. Therefore, wire density rather than congestion should be a unified metric to improve both CMP variation and timing. The proposed wire density driven global routing is implemented in a congestion-driven global router (M. Cho and D. Z. Pan, 2006) for CMP and timing optimization. The new global router utilizes several novel techniques to reduce the wire density of CMP and timing hotspots. Our experimental results are very encouraging. The proposed algorithm improves CMP variation and timing by over 7% with negligible overhead in wirelength and even slightly better routability, compared to the pure congestion-driven global router (M. Cho and D. Z. Pan, 2006)
  • Keywords
    chemical mechanical polishing; circuit optimisation; network routing; wires (electric); chemical-mechanical polishing; congestion metric; global routing; timing optimization; wire density; Algorithm design and analysis; Capacitance; Chemical technology; Copper; Manufacturing; Routing; Scattering; Surfaces; Timing; Wire; Algorithms; Design; Global Routing; Manufacturability; Performance; VLSI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    1-59593-389-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2006.320162
  • Filename
    4110219