Title :
Design and process co-optimization for 28nm/22nm and beyond - A foundry´s perspective
Author_Institution :
Design & Technol. Platform, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
Abstract :
This paper presents challenges in the advanced process technologies, and the need to adopt a new collaboration model between the designer and the foundry.
Keywords :
SPICE; semiconductor device models; SPICE; advanced process technology; collaboration model; process cooptimization; semiconductor device design; size 22 nm; size 28 nm; Collaboration; Costs; Foundries; Manufacturing processes; Process design; Pulp manufacturing; SPICE; Semiconductor device manufacture; Semiconductor devices; Virtual manufacturing;
Conference_Titel :
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4244-5639-0
Electronic_ISBN :
978-1-4244-5640-6
DOI :
10.1109/IEDM.2009.5424324
