• DocumentCode
    1651987
  • Title

    Co-optimizing process development, layout and circuit design for cost-effective 22nm technology platform

  • Author

    Michaels, Kimon

  • Author_Institution
    PDF Solutions, Inc., San Jose, CA, USA
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The economic and technological challenges of process development are threatening the timely availability of advanced nodes. Meanwhile design and product organizations are demanding the continued delivery of Moore´s law density scaling to justify node migration. Balancing the requirements of design with the capabilities and physical limitations of advanced processes will require capitalizing on opportunities for co-optimization between process development, layout and circuit design. In this presentation, we will examine the challenges and highlight the opportunities for achieving an economically feasible path to 22 nm.
  • Keywords
    integrated circuit layout; nanoelectronics; Moore law density scaling; circuit design; circuit layout; cooptimizing process development; cost-effective technology platform; node migration; size 22 nm; Circuit synthesis; Delay effects; Fitting; High K dielectric materials; High-K gate dielectrics; Moore´s Law; Product design; SPICE; Silicon; Systematics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2009 IEEE International
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4244-5639-0
  • Electronic_ISBN
    978-1-4244-5640-6
  • Type

    conf

  • DOI
    10.1109/IEDM.2009.5424325
  • Filename
    5424325