DocumentCode
1651987
Title
Co-optimizing process development, layout and circuit design for cost-effective 22nm technology platform
Author
Michaels, Kimon
Author_Institution
PDF Solutions, Inc., San Jose, CA, USA
fYear
2009
Firstpage
1
Lastpage
1
Abstract
The economic and technological challenges of process development are threatening the timely availability of advanced nodes. Meanwhile design and product organizations are demanding the continued delivery of Moore´s law density scaling to justify node migration. Balancing the requirements of design with the capabilities and physical limitations of advanced processes will require capitalizing on opportunities for co-optimization between process development, layout and circuit design. In this presentation, we will examine the challenges and highlight the opportunities for achieving an economically feasible path to 22 nm.
Keywords
integrated circuit layout; nanoelectronics; Moore law density scaling; circuit design; circuit layout; cooptimizing process development; cost-effective technology platform; node migration; size 22 nm; Circuit synthesis; Delay effects; Fitting; High K dielectric materials; High-K gate dielectrics; Moore´s Law; Product design; SPICE; Silicon; Systematics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location
Baltimore, MD
Print_ISBN
978-1-4244-5639-0
Electronic_ISBN
978-1-4244-5640-6
Type
conf
DOI
10.1109/IEDM.2009.5424325
Filename
5424325
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