Title :
Characterization of thermoelectric devices in ICs as stimulated by a scanning laser beam
Author :
Glowacki, Arkadiusz ; Boit, Christian
Author_Institution :
TUB Berlin Univ. of Technol. Sekr. E2, Germany
Keywords :
Seebeck effect; failure analysis; integrated circuit interconnections; integrated circuit testing; measurement by laser beam; thermoelectric devices; IC failure analysis; OBIRCH; SEI phenomena; Seebeck effect imaging; TLS; bias voltage conditions; constant current condition; constant voltage condition; contacts; interconnects; microelectronics failure analysis; open circuit localization; optical beam induced resistance change; scanning laser beam stimulation; thermal laser stimulation; thermoelectric device characterization; thermoelectric effects; Laser beams; Laser transitions; Optical beams; Optical imaging; Optical materials; Temperature; Thermal resistance; Thermoelectric devices; Thermoelectricity; Voltage;
Conference_Titel :
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN :
0-7803-8803-8
DOI :
10.1109/RELPHY.2005.1493127