DocumentCode
1652103
Title
Testing to eliminate reliability defects from electronic packages
Author
Memis, Irving
Author_Institution
Endicott Interconnect Technol., NY, USA
fYear
2005
Firstpage
462
Lastpage
465
Keywords
circuit reliability; electronics packaging; printed circuit testing; test equipment; LATEST tester; PCB testing; PWB tester; electronic package reliability defects; flexible circuits; intermittent defects; multilayer ceramic circuits; printed circuits; Application software; Circuit testing; Electronic equipment testing; Electronics packaging; Flexible printed circuits; Inspection; Integrated circuit interconnections; Production; System testing; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN
0-7803-8803-8
Type
conf
DOI
10.1109/RELPHY.2005.1493129
Filename
1493129
Link To Document