DocumentCode :
1652221
Title :
Ti-capping technique as a breakthrough for achieving low threshold voltage, high mobility, and high reliability of pMOSFET with metal gate and high-k dielectrics technologies
Author :
Takahashi, Haruhiko ; Minakata, Hiroshi ; Morisaki, Yusuke ; Xiao, Shiqin ; Nakabayashi, Masaaki ; Nishigaya, Keita ; Sakoda, Tsunehisa ; Ikeda, Kazuto ; Morioka, Hiroshi ; Tamura, Naoyoshi ; Kase, Masataka ; Nara, Yasuo
Author_Institution :
Fujitsu Microelectron. Ltd., Kuwanashi, Japan
fYear :
2009
Firstpage :
1
Lastpage :
4
Abstract :
We have proposed inhibition mechanism of common Al-capping technique for pMOSFET threshold-voltage (Vth) control for the first time, and have established effective Ti-capping technique using metal gate and Hf-based high-k dielectrics. Ti-capping technique can adjust lower Vth than Al-capping one due to the suppression of counter dipole and solid solubility limit in doping. Moreover, Ti-capping technique can improve carrier mobility and negative bias temperature instability (NBTI). We have confirmed that Ti-doped devices achieve higher performance, and the technique is suitable for 32 nm-technology node and beyond.
Keywords :
MOSFET; carrier mobility; high-k dielectric thin films; semiconductor device reliability; Ti-capping technique; carrier mobility; counter dipole; dielectrics technologies; high mobility; high reliability; high-k dielectrics; inhibition mechanism; low threshold voltage; metal gate; negative bias temperature instability; pMOSFET; solid solubility; Aluminum oxide; Annealing; Counting circuits; Degradation; Dielectric materials; Hafnium; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4244-5639-0
Electronic_ISBN :
978-1-4244-5640-6
Type :
conf
DOI :
10.1109/IEDM.2009.5424332
Filename :
5424332
Link To Document :
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