1652792

A study of the reliability of mosfets in two stacked thin chips for 3D system in package

Ikeda, Akihiro ; Sugimoto, Yosuke ; Kuwada, Tomonori ; Kajiwara, Satoru ; Fujimura, Tsuyoshi ; Iwasaki, Kazuya ; Ogi, Hiroshi ; Hamaguchi, Kiyoshi ; Kuriyaki, Hisao ; Hattori, Reiji ; Kuroki, Yukinori

Graduate Sch. of Inf. Sci & Electr. Eng, Kyushu Univ., Fukuoka, Japan

2005

578

579

MOS integrated circuits; MOSFET; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; multichip modules; radio equipment; semiconductor device reliability; 3D system in package; MOSFET reliability; RF wireless communication systems; analog CMOS; bump interconnection; digital CMOS; flip chip stacking process; heat radiation; passive components; sensors; stacked chips; stacked thin chips; Fabrication; Flip chip; MOSFETs; Packaging; Rough surfaces; Stacking; Surface roughness; Testing; Wafer bonding; Wireless communication;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493151

1493151