• DocumentCode
    1652792
  • Title

    A study of the reliability of mosfets in two stacked thin chips for 3D system in package

  • Author

    Ikeda, Akihiro ; Sugimoto, Yosuke ; Kuwada, Tomonori ; Kajiwara, Satoru ; Fujimura, Tsuyoshi ; Iwasaki, Kazuya ; Ogi, Hiroshi ; Hamaguchi, Kiyoshi ; Kuriyaki, Hisao ; Hattori, Reiji ; Kuroki, Yukinori

  • Author_Institution
    Graduate Sch. of Inf. Sci & Electr. Eng, Kyushu Univ., Fukuoka, Japan
  • fYear
    2005
  • Firstpage
    578
  • Lastpage
    579
  • Keywords
    MOS integrated circuits; MOSFET; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; multichip modules; radio equipment; semiconductor device reliability; 3D system in package; MOSFET reliability; RF wireless communication systems; analog CMOS; bump interconnection; digital CMOS; flip chip stacking process; heat radiation; passive components; sensors; stacked chips; stacked thin chips; Fabrication; Flip chip; MOSFETs; Packaging; Rough surfaces; Stacking; Surface roughness; Testing; Wafer bonding; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493151
  • Filename
    1493151
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1652792