Title :
Failure analysis of intermittent pin-to-pin short caused by phosphorous particle in molding compound
Author :
Wang, Nathan ; Wu, Jin ; Daniel, Sabbas
Author_Institution :
Cypress Semicond., San Jose, CA, USA
Keywords :
copper; failure analysis; focused ion beam technology; inspection; integrated circuit packaging; large scale integration; moulding; phosphorus; Cu; EDS mapping; FIB; LSI packages; P; acid solution pool; broken coating; copper particles; failure analysis; flame-retardant; focused ion beam; intermittent pin-to-pin short; leakage characteristic; molding compound; passive voltage contrast; phosphorous particle; shorting path; soft X-rays; Acceleration; Clouds; Copper; Failure analysis; Lead; Optical microscopy; Packaging; Pins; Voltage; X-ray imaging;
Conference_Titel :
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN :
0-7803-8803-8
DOI :
10.1109/RELPHY.2005.1493152
