Title :
Electro-optical reliability characterization of advanced cu/low-k interconnects
Author :
Guedj, C. ; Guillaumond, J.F. ; Mondon, F. ; Arnaud, L. ; Arnal, V. ; Reimbold, G. ; Torres, J.
Author_Institution :
Leti, CEA, Centre d´´Etudes de Grenoble, France
Keywords :
electro-optical effects; integrated circuit interconnections; integrated circuit reliability; leakage currents; semiconductor device reliability; Cu; copper/low-k interconnects; electro-optical reliability characterization; integrated devices; leakage currents; light sensitivity; photosensitivity; Aging; Copper; Dielectric materials; Leakage current; Lighting; Materials reliability; Temperature dependence; Temperature sensors; Testing; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN :
0-7803-8803-8
DOI :
10.1109/RELPHY.2005.1493154
