• DocumentCode
    1652850
  • Title

    Electro-optical reliability characterization of advanced cu/low-k interconnects

  • Author

    Guedj, C. ; Guillaumond, J.F. ; Mondon, F. ; Arnaud, L. ; Arnal, V. ; Reimbold, G. ; Torres, J.

  • Author_Institution
    Leti, CEA, Centre d´´Etudes de Grenoble, France
  • fYear
    2005
  • Firstpage
    584
  • Lastpage
    585
  • Keywords
    electro-optical effects; integrated circuit interconnections; integrated circuit reliability; leakage currents; semiconductor device reliability; Cu; copper/low-k interconnects; electro-optical reliability characterization; integrated devices; leakage currents; light sensitivity; photosensitivity; Aging; Copper; Dielectric materials; Leakage current; Lighting; Materials reliability; Temperature dependence; Temperature sensors; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493154
  • Filename
    1493154
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1652850