1654001

Investigation into the correlation of wafer sort and reliability yield using electrical stress testing

Flynn, Andrew ; Millar, Sean

Xilinx Eur. Headquarters, Saggart, Ireland

2005

674

675

CMOS integrated circuits; electric current; integrated circuit reliability; integrated circuit testing; integrated circuit yield; semiconductor device reliability; stress effects; electrical stress testing; mature CMOS product; production burn-in; reliability yield; standby current; wafer sort; CMOS logic circuits; Costs; Current measurement; Life testing; Logic testing; Manufacturing processes; Production; Stress; Vehicles; Voltage control;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493199

1493199