• DocumentCode
    1654001
  • Title

    Investigation into the correlation of wafer sort and reliability yield using electrical stress testing

  • Author

    Flynn, Andrew ; Millar, Sean

  • Author_Institution
    Xilinx Eur. Headquarters, Saggart, Ireland
  • fYear
    2005
  • Firstpage
    674
  • Lastpage
    675
  • Keywords
    CMOS integrated circuits; electric current; integrated circuit reliability; integrated circuit testing; integrated circuit yield; semiconductor device reliability; stress effects; electrical stress testing; mature CMOS product; production burn-in; reliability yield; standby current; wafer sort; CMOS logic circuits; Costs; Current measurement; Life testing; Logic testing; Manufacturing processes; Production; Stress; Vehicles; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493199
  • Filename
    1493199
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1654001