Analysis Ball Grid Array defects by using new image technique

BGA (Ball Grid Array) is one type of integrated circuit (IC) has been used in electronics assembly. To inspect the BGA quality, it normally used the X-ray image for detection BGA defects. Most of research in the field of BGA quality detection can be detected short circuit, big ball and small ball. This work presents the new image processing technique to detect all cases above and also detect the void case. All of these defects effect to reliability and quality of products. This work analyzes the X-Ray images of BGA 48 and 100 balls. The results of this technique can detect short circuit, big ball, small ball and void case 100%. The advantage results of this technique can help and feedback to process for the quality improvement of products and production lines.