• DocumentCode
    1654186
  • Title

    Copper via chain under etching process improvement

  • Author

    Ji, Jackie ; Zhang, Mark ; Dong, Walden ; Guo, Annie ; Liang, Sanan ; Liao, Scott ; Niou, Chorng ; Chien, Kary

  • Author_Institution
    Reliability Div., Semicond. Manuf. Int. Corp., Shanghai, China
  • fYear
    2005
  • Firstpage
    688
  • Lastpage
    689
  • Keywords
    etching; failure analysis; focused ion beam technology; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; transmission electron microscopy; Cu; FIB; OBIRCH; PVC; TEM; WAT test structure; dual damascene process; etching process improvement; failure analysis; fault isolation methods; focused ion beam; localized via chain under etching; optical beam induced resistance change; passive voltage contrast; transmission electron microscope; via chain open failures; wafer accept test; Aluminum; Conductivity; Copper; Etching; Fabrication; Failure analysis; Plasma applications; Scanning electron microscopy; Silicon compounds; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493206
  • Filename
    1493206
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1654186