• DocumentCode
    1654213
  • Title

    Stress migration related reliability concerns

  • Author

    Ma, Jenny J Y ; Tseng, Summer F C ; Chien, Kary W T ; Ruan, Vivi W W

  • Author_Institution
    Reliability Eng. Div., Semicond. Manuf. Int. Corp., Shanghai, China
  • fYear
    2005
  • Firstpage
    690
  • Lastpage
    691
  • Keywords
    curing; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; plasma materials processing; thermal stresses; tungsten; voids (solid); CMP; EKC; IC interconnect reliability; ILD film thickness; UV cure conditions; W; WLRC; ash recipe; failure analyses; galvanic effects; interlayer dielectrics; plasma ashing; plug voids; self-heated SM test pattern structure; stress migration; via chain test structures; via missing tungsten; wafer level temperature cycling; Automatic testing; Dielectrics; Etching; Failure analysis; Plasma applications; Plugs; Probes; Samarium; Solvents; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493207
  • Filename
    1493207
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1654213