• DocumentCode
    1654260
  • Title

    A new gate oxide lifetime prediction method using cumulative damage law and its applications to plasma-damaged oxides

  • Author

    Eriguchi, K. ; Uraoka, Y. ; Odanaka, S.

  • Author_Institution
    Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Moriguchi, Japan
  • fYear
    1995
  • Firstpage
    323
  • Lastpage
    326
  • Abstract
    The Cumulative Damage Law for the electrical stress, which correlates charge-to-breakdown with constant current injection (Qbd ) to time-to-breakdown with constant-voltage stress (tbd), is theoretically derived from the defect generation model. Based on this law, we propose a new gate oxide lifetime prediction method. Although in some cases, the degradation of gate oxide induced by the plasma and ion implantation processes can not be distinguished by tbd measurement, the new method allows an accurate and relevant evaluation of process-induced gate oxide degradation
  • Keywords
    MOSFET; ion implantation; plasma applications; semiconductor device models; semiconductor device reliability; MOSFETs; charge-to-breakdown; constant current injection; constant-voltage stress; cumulative damage law; defect generation model; electrical stress; gate oxide lifetime prediction; ion implantation processes; plasma-damaged oxides; process-induced gate oxide degradation; reliability; time-to-breakdown; Degradation; Design for quality; Electrons; Plasma immersion ion implantation; Plasma measurements; Prediction methods; Programmable logic arrays; Stress; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1995. IEDM '95., International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2700-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1995.499206
  • Filename
    499206