Title :
A new gate oxide lifetime prediction method using cumulative damage law and its applications to plasma-damaged oxides
Author :
Eriguchi, K. ; Uraoka, Y. ; Odanaka, S.
Author_Institution :
Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Moriguchi, Japan
Abstract :
The Cumulative Damage Law for the electrical stress, which correlates charge-to-breakdown with constant current injection (Qbd ) to time-to-breakdown with constant-voltage stress (tbd), is theoretically derived from the defect generation model. Based on this law, we propose a new gate oxide lifetime prediction method. Although in some cases, the degradation of gate oxide induced by the plasma and ion implantation processes can not be distinguished by tbd measurement, the new method allows an accurate and relevant evaluation of process-induced gate oxide degradation
Keywords :
MOSFET; ion implantation; plasma applications; semiconductor device models; semiconductor device reliability; MOSFETs; charge-to-breakdown; constant current injection; constant-voltage stress; cumulative damage law; defect generation model; electrical stress; gate oxide lifetime prediction; ion implantation processes; plasma-damaged oxides; process-induced gate oxide degradation; reliability; time-to-breakdown; Degradation; Design for quality; Electrons; Plasma immersion ion implantation; Plasma measurements; Prediction methods; Programmable logic arrays; Stress; Testing; Voltage;
Conference_Titel :
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2700-4
DOI :
10.1109/IEDM.1995.499206