DocumentCode
1654260
Title
A new gate oxide lifetime prediction method using cumulative damage law and its applications to plasma-damaged oxides
Author
Eriguchi, K. ; Uraoka, Y. ; Odanaka, S.
Author_Institution
Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Moriguchi, Japan
fYear
1995
Firstpage
323
Lastpage
326
Abstract
The Cumulative Damage Law for the electrical stress, which correlates charge-to-breakdown with constant current injection (Qbd ) to time-to-breakdown with constant-voltage stress (tbd), is theoretically derived from the defect generation model. Based on this law, we propose a new gate oxide lifetime prediction method. Although in some cases, the degradation of gate oxide induced by the plasma and ion implantation processes can not be distinguished by tbd measurement, the new method allows an accurate and relevant evaluation of process-induced gate oxide degradation
Keywords
MOSFET; ion implantation; plasma applications; semiconductor device models; semiconductor device reliability; MOSFETs; charge-to-breakdown; constant current injection; constant-voltage stress; cumulative damage law; defect generation model; electrical stress; gate oxide lifetime prediction; ion implantation processes; plasma-damaged oxides; process-induced gate oxide degradation; reliability; time-to-breakdown; Degradation; Design for quality; Electrons; Plasma immersion ion implantation; Plasma measurements; Prediction methods; Programmable logic arrays; Stress; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location
Washington, DC
ISSN
0163-1918
Print_ISBN
0-7803-2700-4
Type
conf
DOI
10.1109/IEDM.1995.499206
Filename
499206
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