Title :
Impact of TSV area on the dynamic range and frame rate performance of 3D-integrated image sensors
Author :
Xhakoni, Adi ; Bello, David San Segundo ; Gielen, Georges
Author_Institution :
Dept. Elektrotech. ESAT- MICAS, K.U. Leuven, Leuven, Belgium
Abstract :
This paper introduces a 3D-integrated image sensor with high dynamic range, high frame rate and high resolution capabilities. A robust algorithm for dynamic range extension with low sensitivity to circuit non-idealities and based on multiple exposures is presented. The impact of the TSV diameter over the dynamic range and frame rate performance is studied allowing the choice of the best 3D technology for the required performance.
Keywords :
CMOS image sensors; image resolution; three-dimensional integrated circuits; 3D technology; 3D-integrated image sensor; TSV area; TSV diameter; circuit nonidealities; dynamic range extension; frame rate performance; high resolution capability; robust algorithm; CMOS image sensors; Capacitors; Dynamic range; Signal to noise ratio; Through-silicon vias; 3D integration; CMOS image sensor; high dynamic range; high frame rate;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2012
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-2145-8
DOI :
10.1109/DATE.2012.6176611
