DocumentCode
1654868
Title
A generic model for cluster tool throughput time and capacity
Author
Wood, Samuel C. ; Tripathi, Sanjay ; Moghadam, Farhad
Author_Institution
Graduate Sch. of Bus., Stanford Univ., CA, USA
fYear
1994
Firstpage
194
Lastpage
199
Abstract
The throughput time within a cluster tool can be approximated as T+lt, where T is the fixed throughput time of the cluster, l is the lot size, and t is the average incremental throughput time resulting from a lot size increase of one wafer. Simulations of different cluster tools are used to illustrate and validate the model. The fixed throughput time (T) consists of both an external component associated with loadlock operations such as loading and pumping, and an internal component resulting from dynamic effects such as congestion in the cluster tool. The expressions for the incremental throughput time (t) includes the wafer handling time, and may include the module processing time. This model predicts that the maximum throughput rate of the cluster tool is 1/t, and that this throughput rate can only be achieved if multiple lots can simultaneously access the cluster tool. The model also predicts that this number of lots must increase, for example, as lot size decreases, the number of identical modules on a cluster increases, or lot loading time increases. This model was applied to a CVD cluster tool at Intel Corporation. The model predicted an increase in the cluster´s throughput rate of roughly 10% over current operating practice, if one lot could be loaded while a different lot was being processed. The model was verified using a simulator and then on the cluster tool itself
Keywords
cluster tools; CVD cluster tool; cluster tool capacity; cluster tool throughput time; dynamic effects; generic model; loadlock operations; lot size; module processing time; wafer handling time; Analytical models; Chemical technology; Chemical vapor deposition; Costs; Economic forecasting; Educational institutions; Modems; Predictive models; Semiconductor device modeling; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-2053-0
Type
conf
DOI
10.1109/ASMC.1994.588245
Filename
588245
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