A practical substrate modeling algorithm with active guardband macromodel for mixed-signal substrate coupling verification

Author

Chan, Henry H Y ; Zilic, Zeljko

Author_Institution

McGill Univ., Montreal, Que., Canada

Volume

3

fYear

2001

fDate

6/23/1905 12:00:00 AM

Firstpage

1455

Abstract

Substrate-coupled switching noise is a major concern for mixed-signal circuit design. In this paper, an efficient substrate extraction algorithm based on Delaunay triangulation is proposed for heavily-doped bulk substrate. Macromodel of active noise suppression guard band that enhances noise insulation efficiency is also incorporated. SPICE simulation results of circuit layouts comprising the proposed substrate model are compared against those generated by Cadence Substrate Coupling Analysis tool

Keywords

SPICE; circuit layout CAD; circuit simulation; integrated circuit layout; integrated circuit noise; mesh generation; mixed analogue-digital integrated circuits; Cadence substrate coupling analysis tool; Delaunay triangulation; SPICE simulation; active noise suppression; circuit layouts; guard band; heavily-doped bulk substrate; mixed-signal circuit design; noise insulation efficiency; substrate extraction algorithm; substrate-coupled switching noise; Active noise reduction; Analytical models; Circuit noise; Circuit simulation; Costs; Coupling circuits; Interference; Protection; SPICE; Switching circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems, 2001. ICECS 2001. The 8th IEEE International Conference on

Print_ISBN

0-7803-7057-0

Type

conf

DOI

10.1109/ICECS.2001.957489

Filename

957489