DocumentCode
1656584
Title
Influence of Chemicals on Biofilm Removal in Cooling Water System
Author
Ran Xu ; Haifeng Wang ; Fengting Li ; Jianhua Li ; Bingru Zhang ; Junlian Qiao
Author_Institution
Key Lab. of Yangtze River Water Environ., Tongji Univ., Shanghai
fYear
2008
Firstpage
1119
Lastpage
1122
Abstract
Microbial cells can attach onto the stainless steel surface in cooling water system and form biofilms which are harmful to the industrial equipments. In this study, biofilms formed on stainless steel with mixed bacterial were investigated by scanning electron microscopy (SEM) to discuss the biofilm transformation before and after treatment with chemicals. Oxidizing biocide (Tetrakishydroxymethyl phosphonium sulphate), non-oxidizing biocide (Sodium hypochlorite), and surfactant (sodium dodeccyl benzene sulfonate) were selected for biofilm treatment. SEM photos showed that the low-molecular weight biocide possessed penetration function and the oxidizing-biocide exhibited strong oxidation ability. Anionic surfactant could change the dimensional structure of biofilm and was helpful for further treatment.
Keywords
antibacterial activity; chemical technology; cooling; films; microorganisms; oxidation; production equipment; scanning electron microscopy; stainless steel; surface treatment; surfactants; FeCCr; SEM; anionic surfactant; biofilm removal; biofilm transformation; biofilm treatment; biofilms formation; chemical influence; cooling water system; industrial equipments; microbial cells; nonoxidizing biocide; oxidation ability; oxidizing biocide; scanning electron microscopy; sodium dodeccyl benzene sulfonate surfactant; sodium hypochlorite; stainless steel surface; tetrakishydroxymethyl phosphonium sulphate; Chemical industry; Cooling; Inductors; Metals industry; Microorganisms; Robustness; Scanning electron microscopy; Steel; Surface treatment; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomedical Engineering, 2008. ICBBE 2008. The 2nd International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1747-6
Electronic_ISBN
978-1-4244-1748-3
Type
conf
DOI
10.1109/ICBBE.2008.273
Filename
4535153
Link To Document