• DocumentCode
    1656827
  • Title

    Asymmetry of MTJ switching and its implication to STT-RAM designs

  • Author

    Zhang, Yaojun ; Wang, Xiaobin ; Li, Yong ; Jones, A.K. ; Chen, Yiran

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Pittsburgh, Pittsburgh, PA, USA
  • fYear
    2012
  • Firstpage
    1313
  • Lastpage
    1318
  • Abstract
    As one promising candidate for next-generation nonvolatile memory technologies, spin-transfer torque random access memory (STT-RAM) has demonstrated many attractive features, such as nanosecond access time, high integration density, non-volatility, and good CMOS process compatibility. In this paper, we reveal an important fact that has been neglected in STT-RAM designs for long: the write operation of a STT-RAM cell is asymmetric based on the switching direction of the MTJ (magnetic tunneling junction) device: the mean and the deviation of the write latency for the switching from low- to high-resistance state is much longer or larger than that of the opposite switching. Some special design concerns, e.g., the write-pattern-dependent write reliability, are raised by this observation. We systematically analyze the root reasons to form the asymmetric switching of the MTJ and study their impacts on STT-RAM write operations. These factors include the thermal-induced statistical MTJ magnetization process, asymmetric biasing conditions of NMOS transistors, and both NMOS and MTJ device variations. We also explore the design space of different design methodologies on capturing the switching asymmetry of different STT-RAM cell structures. Our experiment results proved the importance of full statistical design method in STT-RAM designs for design pessimism minimization.
  • Keywords
    CMOS memory circuits; MOSFET; integrated circuit reliability; magnetic tunnelling; random-access storage; statistical analysis; CMOS process compatibility; MTJ switching asymmetry; NMOS transistors; STT-RAM cell structures; STT-RAM design; asymmetric biasing conditions; design pessimism minimization; high integration density; magnetic tunneling junction device; nanosecond access time; next-generation nonvolatile memory technologies; reliability; spin-transfer torque random access memory; statistical design method; thermal-induced statistical MTJ magnetization process; write-pattern-dependent; MOSFETs; Magnetic tunneling; Random access memory; Resistance; Switches; Switching circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition (DATE), 2012
  • Conference_Location
    Dresden
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-4577-2145-8
  • Type

    conf

  • DOI
    10.1109/DATE.2012.6176695
  • Filename
    6176695