Title :
A system-theoretic approach to modeling and analysis of deposition rate uniformity in PECVD
Author :
Hamby, E.S. ; Kabamba, P.T. ; Meerkov, S.M.
Author_Institution :
Dept. of Aerosp. Eng., Michigan Univ., Ann Arbor, MI, USA
Abstract :
This paper gives an overview of the modeling methodology being developed for the analysis of plasma-enhanced chemical vapor deposition (PECVD) processes. The following are components in our modeling effort: a comprehensive numerical simulation using the software package FLUENT, a lower order analytical model, and an error analysis
Keywords :
chemical vapour deposition; digital simulation; error analysis; plasma CVD; semiconductor technology; simulation; deposition rate uniformity; error analysis; lower order analytical model; modeling; plasma-enhanced chemical vapor deposition; software package FLUENT; system theory; Analytical models; Chemical analysis; Electrodes; Inductors; Numerical simulation; Plasma applications; Plasma chemistry; Plasma simulation; Plasma sources; Solid modeling;
Conference_Titel :
Decision and Control, 1994., Proceedings of the 33rd IEEE Conference on
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-1968-0
DOI :
10.1109/CDC.1994.411041
