Title :
Mechanical Properties of Mono-crystalline Silicon Thin Films Measured by Different Methods
Author :
Li, Xueping ; Ding, Guifu ; Ando, Taeko ; Shikida, Mitsuhiro ; Sato, Kazuo
Author_Institution :
Key Lab. for Thin Film & Microfabrication Technol. of Minist. of Educ., Shanghai Jiao Tong Univ.
Abstract :
In order to investigate the reliability of the mechanical properties of mono-crystalline silicon thin films (thickness of 5 mum), a uniaxial tensile test and a nanoindentation test were conducted, respectively, on samples of identical composition and under identical conditions. The tensile samples were 100 mum long, 50 mun wide, and microfabricated on the silicon-on-insulation (SOI) wafer. It was founded that for mono-crystalline silicon thin films, using tensile test can measured Young´s modulus on main crystallographic orientations independently, and <-110> orientation has a slightly higher Young´s modulus than <100> orientation for both Si(001) and Si(110) films. From the nanoindentation test, measured Young´s modulus slightly varied with provided Poisson´s ratio, and Si(110) films have slightly superior mechanical properties to Si(001) films. Young´s modulus of silicon thin films measured by different testing methods does not differ significantly
Keywords :
Young´s modulus; elemental semiconductors; indentation; micromechanical devices; semiconductor thin films; silicon; silicon-on-insulator; tensile testing; 5 micron; Si; Si films; Youngs modulus; mechanical properties; microfabrication; mono-crystalline silicon thin films; nanoindentation test; silicon-on-insulation wafer; uniaxial tensile test; Educational technology; Fabrication; Materials testing; Mechanical factors; Mechanical variables measurement; Semiconductor films; Semiconductor thin films; Silicon; Substrates; Thin film sensors;
Conference_Titel :
Micro-NanoMechatronics and Human Science, 2006 International Symposium on
Conference_Location :
Nagoya
Print_ISBN :
1-4244-0717-6
Electronic_ISBN :
1-4244-0718-1
DOI :
10.1109/MHS.2006.320287