• DocumentCode
    165709
  • Title

    Electric field and surface step assisted Cu3Si nanowire growth by reactive deposition epitaxy

  • Author

    Jian-Yih Cheng ; Ng, Poh-Keong ; Fisher, Brent ; Lilley, Carmen M.

  • Author_Institution
    Dept. of Mech. & Ind. Eng., Univ. of Illinois at Chicago, Chicago, IL, USA
  • fYear
    2014
  • fDate
    18-21 Aug. 2014
  • Firstpage
    478
  • Lastpage
    481
  • Abstract
    Metal silicide nanowires such as copper silicide have been shown to self-assemble into nanowire and nanoisland structures on the surface of silicon substrates. The self-assembly of these nanostructures occurs during reactive deposition epitaxy (RDE). It was observed that varying the surface step orientation of a sample with respect to an applied electric field had a direct influence on the length of vicinal steps and the length of self-assembled nanowires grown using RDE. Si(110) substrates were diced so that the [110] surface step directions with respect to the applied electric field direction were parallel, perpendicular, and 45°. All samples were prepared using the same preparation and Cu deposition parameters. Under the same growth parameters perpendicular orientation samples resulted in the longest thinnest nanowires, parallel orientation samples had short wider wires, whilst the 45° orientation samples had wire dimensions slightly larger than those on the parallel orientation samples.
  • Keywords
    copper compounds; epitaxial layers; island structure; nanofabrication; nanowires; self-assembly; vacuum deposition; vapour phase epitaxial growth; Cu deposition parameters; Cu3Si; Si; Si(110) substrates; [110] surface step directions; applied electric field direction; copper silicide; growth parameters; metal silicide nanowires; nanoisland structures; nanowire structures; perpendicular orientation samples; reactive deposition epitaxy; surface step assisted nanowire growth; surface step orientation; Electric fields; Nanostructures; Self-assembly; Silicides; Silicon; Substrates; Surface treatment; Copper; Nanowire; Self-Assembly; Silicide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology (IEEE-NANO), 2014 IEEE 14th International Conference on
  • Conference_Location
    Toronto, ON
  • Type

    conf

  • DOI
    10.1109/NANO.2014.6968103
  • Filename
    6968103