DocumentCode
1657187
Title
Compensation of thermal errors in vision based measurement systems using a system identification approach
Author
Handel, Holger
Author_Institution
Inst. for Comput. Med., Univ. of Heidelberg, Mannheim
fYear
2008
Firstpage
1329
Lastpage
1333
Abstract
This article presents a method to compensate thermal influences on optical 3D measurement devices which are widely used as high-accurate localisation devices. Thermal expansion caused by ambient temperature changes or by self-heating of the measurement device itself leads to a changing device geometry which in turn can lead to significant positioning errors since an accurate knowledge of the device geometry is essential for triangulation based 3D reconstruction. The changing imaging geometry of the device results in changing camera parameters which can be determined during a calibration step. The dependency between temperature change and the change of the camera parameters can be modeled using system identification methods. The device temperature is considered as the input signal to a linear time invariant (LTI) system and the vector of camera parameters describing the imaging geometry as the corresponding output. Once the model is determined for a specific camera it can be used online to adjust the values of the camera parameters.
Keywords
calibration; computer vision; computerised instrumentation; geometry; measurement systems; thermal expansion; ambient temperature; calibration step; camera parameter change; device geometry; high-accurate localisation devices; imaging geometry; linear time invariant system; optical 3D measurement devices; system identification approach; temperature change; thermal error compensation; thermal expansion; triangulation based 3D reconstruction; vision based measurement systems; Cameras; Geometrical optics; Geometry; Machine vision; Optical devices; Optical imaging; Position measurement; System identification; Temperature; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Processing, 2008. ICSP 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2178-7
Electronic_ISBN
978-1-4244-2179-4
Type
conf
DOI
10.1109/ICOSP.2008.4697377
Filename
4697377
Link To Document