DocumentCode :
1657214
Title :
A 0.25 μm CMOS technology with 45 Å NO-nitrided oxide
Author :
Luo, Marie S C ; Tsui, Paul V G ; Chen, Wei-Ming ; Gilbert, Percy V. ; Maiti, Bikas ; Sitaram, A.R. ; Sun, Shih-Wei
Author_Institution :
Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
fYear :
1995
Firstpage :
691
Lastpage :
694
Abstract :
This paper describes the device design and fabrication of a 0.25 μm CMOS process integrated with 45 Å oxynitride gate dielectric for high-performance logic applications. Channel profile engineering is applied to control short-channel effects. With TiN-capped Co salicide, the gate sheet resistance is reduced to less than 5 Ω/sq at 0.18 μm. Ring oscillator gate delay of 26 ps/stage is accomplished at a supply voltage of 1.8 V
Keywords :
CMOS integrated circuits; CMOS logic circuits; dielectric thin films; integrated circuit technology; 0.25 micron; 1.8 V; 45 A; CMOS technology; NO-nitrided oxide; SiNO-Si; TiN-CoSi; TiN-capped Co salicide; channel profile engineering; device design; fabrication; gate sheet resistance reduction; high-performance logic applications; oxynitride gate dielectric; short-channel effects control; CMOS logic circuits; CMOS process; CMOS technology; Delay; Dielectric devices; Fabrication; Logic design; Logic devices; Ring oscillators; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location :
Washington, DC
ISSN :
0163-1918
Print_ISBN :
0-7803-2700-4
Type :
conf
DOI :
10.1109/IEDM.1995.499313
Filename :
499313
Link To Document :
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