DocumentCode
1657836
Title
Highly conductive aligned carbon film for interconnect application
Author
Li, Fushan ; Shakerzadeh, Maziar ; Tan, Chongwei ; Yu, Hongyu ; Tay, Bengkang
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2010
Firstpage
730
Lastpage
731
Abstract
We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.
Keywords
carbon; conducting materials; electrical conductivity; electrical conductivity transitions; thin films; C; Kelvin structure; amorphous carbon film; effective carriers transport channel; electrical conductivity; graphite-like sheet; highly conductive aligned carbon film; highly conductive transition phase; interconnect application; Amorphous materials; Conductive films; Conductivity; Copper; Electric resistance; Electrical resistance measurement; Integrated circuit interconnections; Kelvin; Semiconductor films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424560
Filename
5424560
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