• DocumentCode
    1657836
  • Title

    Highly conductive aligned carbon film for interconnect application

  • Author

    Li, Fushan ; Shakerzadeh, Maziar ; Tan, Chongwei ; Yu, Hongyu ; Tay, Bengkang

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2010
  • Firstpage
    730
  • Lastpage
    731
  • Abstract
    We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.
  • Keywords
    carbon; conducting materials; electrical conductivity; electrical conductivity transitions; thin films; C; Kelvin structure; amorphous carbon film; effective carriers transport channel; electrical conductivity; graphite-like sheet; highly conductive aligned carbon film; highly conductive transition phase; interconnect application; Amorphous materials; Conductive films; Conductivity; Copper; Electric resistance; Electrical resistance measurement; Integrated circuit interconnections; Kelvin; Semiconductor films; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424560
  • Filename
    5424560