Title :
Interface effects on thermal conductivity of Bi/Te core-shell nanowires
Author :
Kang, Joohoon ; Ham, Jinhee ; Roh, Jong Wook ; Lee, Seunghyun ; Lee, Wooyoung
Author_Institution :
Dept. of Mater. Sci. & Eng., Yonsei Univ., Seoul, South Korea
Abstract :
The formation of variable 1D heterostructure including core-shell and tubular nanowire is of particular significance with respect to potential applications for the thermoelectric device with the enhanced figure of merit (ZT=S2¿T/¿). We report Bi-Te core/shell and Te tubular nanowire fabrication based on the stress induced method. Fig. 1 schematically shows the nanowire fabrication process. Bi nanowires are grown on the Si substrate by the stress-induced method, and then Te is evaporated on the Bi nanowires. Fig. 2 is TEM image clearly shows core/shell structure for which effective phonon scattering and quantum confinement effect are expected. Our results demonstrate that various 1D heterostructure like Bi-Te core/shell and Te tubular nanowire can be grown successfully by the stress-induced method. Based on the result of electrical transport measurement and its characteristic morphology of rough surface, we will measure Seebeck coefficient and thermal conductivity in the future work.
Keywords :
Seebeck effect; bismuth; electrical conductivity; evaporation; internal stresses; nanofabrication; nanowires; phonons; surface morphology; surface roughness; tellurium; thermal conductivity; transmission electron microscopy; 1D heterostructure; Bi-Te; Seebeck coefficient; TEM image; Te; core-shell nanowires; electrical transport measurement; evaporation; interface effects; nanowire fabrication process; phonon scattering; quantum confinement effect; rough surface morphology; stress-induced method; thermal conductivity; thermoelectric device applications; tubular nanowire; Bismuth; Conductivity measurement; Electric variables measurement; Fabrication; Nanowires; Structural shells; Tellurium; Thermal conductivity; Thermal stresses; Thermoelectric devices;
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
DOI :
10.1109/INEC.2010.5424564