DocumentCode
1658081
Title
Difference of Growth, Copper Accumulation and Mineral Element Uptake in Two Elsholtzia Haichowensis Populations under Copper and Mineral Nutrition Stress
Author
Ke, Wenshan ; Xiong, Zhiting
Author_Institution
Coll. of Life Sci., Hubei Univ., Wuhan
fYear
2008
Firstpage
4704
Lastpage
4708
Abstract
Two Elsholtzia haichowensis populations, one from a copper mine (CS) and the other from an uncontaminated site (UCS), were studied in hydroponic experiments for the plant growth, copper accumulation and mineral nutrients content under excess copper and nutrient deficiency conditions. The results indicated that the CS population had evolved not only Cu tolerance but also tolerance to low nutrient supply. Under Cu treatments, the CS population had less Cu accumulation in roots than the UCS one, suggesting the root exclusion mechanism existing in the former. It was also found that general nutrient deficiency markedly promoted Cu uptake and transport in the two populations. But CS population had less Cu accumulation than UCS population did. Under Cu stress, the CS population had less change in nutrient composition than the UCS one. The similar result was observed in general nutrient deficiency experiment. The results indicated that the mineral composition homeostasis under the stresses was important in metal tolerance and colonizing normally in the Cu-enriched soils for the Cu-tolerant population.
Keywords
biochemistry; botany; copper; soil; toxicology; Cu; Elsholtzia haichowensis; copper accumulation; copper mine; copper stress; excess copper conditions; hydroponic experiments; metal tolerance; mineral composition homeostasis; mineral element uptake; mineral nutrition stress; nutrient deficiency conditions; plant growth; root exclusion mechanism; Biotechnology; Chemical elements; Chemistry; Copper; Educational institutions; Inorganic materials; Minerals; Soil; Stress; Sun;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomedical Engineering, 2008. ICBBE 2008. The 2nd International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1747-6
Electronic_ISBN
978-1-4244-1748-3
Type
conf
DOI
10.1109/ICBBE.2008.334
Filename
4535214
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