DocumentCode
1658129
Title
A consistent model for the thickness dependence of intrinsic breakdown in ultra-thin oxides
Author
Degraeve, R. ; Groeseneken, G. ; Bellens, R. ; Depas, M. ; Maes, H.E.
Author_Institution
IMEC, Leuven, Belgium
fYear
1995
Firstpage
863
Lastpage
866
Abstract
A consistent model for the intrinsic time dependent dielectric breakdown (TDDB) of thin oxides is introduced. This model links the existing anode hole injection and the electron trap generation models together and describes wearout as a hole induced generation of electron traps. Breakdown is defined as conduction via these traps from one interface to the other. Implementing the model in a simulator, the oxide thickness dependence of the Weibull slope of the QBD-distribution is predicted, and, using the unique relationship between hole fluence and generated electron trap density, the decrease of the critical hole fluence with oxide thickness is explained
Keywords
MOS integrated circuits; Weibull distribution; electric breakdown; electron traps; hole traps; integrated circuit modelling; integrated circuit reliability; IC reliability; MOS integrated circuits; Weibull slope; anode hole injection model; critical hole fluence; electron trap generation model; hole induced generation; intrinsic breakdown; thickness dependence; time dependent dielectric breakdown; ultra-thin oxides; Anodes; Dielectric breakdown; Dielectric thin films; Electric breakdown; Electron traps; Electronic mail; Filling; Predictive models; Quadratic programming; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location
Washington, DC
ISSN
0163-1918
Print_ISBN
0-7803-2700-4
Type
conf
DOI
10.1109/IEDM.1995.499353
Filename
499353
Link To Document