• DocumentCode
    1658129
  • Title

    A consistent model for the thickness dependence of intrinsic breakdown in ultra-thin oxides

  • Author

    Degraeve, R. ; Groeseneken, G. ; Bellens, R. ; Depas, M. ; Maes, H.E.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    1995
  • Firstpage
    863
  • Lastpage
    866
  • Abstract
    A consistent model for the intrinsic time dependent dielectric breakdown (TDDB) of thin oxides is introduced. This model links the existing anode hole injection and the electron trap generation models together and describes wearout as a hole induced generation of electron traps. Breakdown is defined as conduction via these traps from one interface to the other. Implementing the model in a simulator, the oxide thickness dependence of the Weibull slope of the QBD-distribution is predicted, and, using the unique relationship between hole fluence and generated electron trap density, the decrease of the critical hole fluence with oxide thickness is explained
  • Keywords
    MOS integrated circuits; Weibull distribution; electric breakdown; electron traps; hole traps; integrated circuit modelling; integrated circuit reliability; IC reliability; MOS integrated circuits; Weibull slope; anode hole injection model; critical hole fluence; electron trap generation model; hole induced generation; intrinsic breakdown; thickness dependence; time dependent dielectric breakdown; ultra-thin oxides; Anodes; Dielectric breakdown; Dielectric thin films; Electric breakdown; Electron traps; Electronic mail; Filling; Predictive models; Quadratic programming; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1995. IEDM '95., International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2700-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1995.499353
  • Filename
    499353