Title :
Life-cycle Assessment of LSI Packaging Embossed Tape Made from Bio-based Polymer
Author :
Horikoshi, Y. ; Hashitani, T. ; Kutami, M. ; Yazaki, K. ; Ando, Y.
Author_Institution :
Fujitsu Labs. Ltd.
Abstract :
This paper assesses the life-cycle of packaging materials designed to protect large-scale integration devices from shock and static electricity when they are transported from semiconductor factories to printed-circuit-board factories. Carbon dioxide (CO2) emitted during production and incineration was reduced by 11% when embossed plastic tape packaging made from non-renewable sources was replaced by material made from bio-based polymer
Keywords :
incineration; plastic packaging; polymers; semiconductor device packaging; LSI packaging; bio-based polymer; carbon dioxide emissions; embossed plastic tape; incineration; integration devices; life-cycle assessment; nonrenewable sources; packaging materials; printed-circuit-board factories; semiconductor factories; shock; static electricity; Biological materials; Carbon dioxide; Electric shock; Incineration; Large scale integration; Polymers; Production facilities; Protection; Semiconductor device packaging; Semiconductor materials;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
1-4244-0081-3
DOI :
10.1109/ECODIM.2005.1619183
