DocumentCode
1660172
Title
Modeling and simulation of 2 kV 50 A SiC MOSFET/JBS power modules
Author
Chen, Zheng ; Burgos, Rolando ; Boroyevich, Dushan ; Wang, Fred ; Leslie, Scott
Author_Institution
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fYear
2009
Firstpage
1
Lastpage
10
Abstract
This paper presents a methodology for modeling the high-voltage silicon carbide (SiC) MOSFET/junction-barrier Schottky (JBS) diode power modules. The electrical model of an actual high-voltage SiC MOSFET/JBS module has been obtained using computer-aided electromagnetic analysis and verified through measurements. A circuit simulation model of a 2 kV, 5 A 4-H SiC MOSFET has also been built based on the Hefner MOSFET model and published experimental data. The device and package models are then combined and used to run circuit simulations of a double-pulse tester. The simulation results obtained provide good insight into the fast switching behavior and parametric dependencies of the paralleled SiC dice, which will aid in the module physical layout and gate driver design, as well as switching and conduction loss analysis.
Keywords
MOSFET; Schottky barriers; Schottky diodes; circuit simulation; silicon compounds; wide band gap semiconductors; Hefner MOSFET model; MOSFET-JBS power modules; SiC; circuit simulation model; circuit simulations; computer-aided electromagnetic analysis; conduction loss analysis; current 5 A; current 50 A; double pulse tester; electrical model; gate driver design; junction-barrier Schottky diode power modules; module physical layout; package models; switching loss analysis; voltage 2 kV; Circuit simulation; Circuit testing; Computational modeling; Electromagnetic analysis; Electromagnetic modeling; MOSFET circuits; Multichip modules; Power MOSFET; Schottky diodes; Silicon carbide; MOSFET; Modeling; Silicon Carbide; Simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2009. EPE '09. 13th European Conference on
Conference_Location
Barcelona
Print_ISBN
978-1-4244-4432-8
Electronic_ISBN
978-90-75815-13-9
Type
conf
Filename
5278725
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