• DocumentCode
    1660267
  • Title

    Defect characterization for scaling of QCA devices [quantum dot cellular automata ]

  • Author

    Huang, Jing ; Momenzadeh, Mariam ; Tahoori, Mehdi B. ; Lombardi, Fabrizio

  • Author_Institution
    Dept of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
  • fYear
    2004
  • Firstpage
    30
  • Lastpage
    38
  • Abstract
    In this paper, we present the impact of scaling on defects that may arise in the manufacturing of quantum dot cellular automata (QCA) devices. This study shows how the sensitivity to manufacturing processing variations changes with device scaling. Scaling in QCA technology is related to cell dimension/size and cell-to-cell spacing within a Cartesian layout. Extensive simulation results on scaling of QCA devices, such as the majority voter, the inverter and the binary wire, are provided to show that defects have definitive trends in their behavior. These trends relate cell size (l) to the smallest cell-to-cell spacing (d) for erroneous behavior in the presence of different defects (such as misalignment and displacement); their impact on the correct functionality of QCA devices is extensively discussed. It is shown that in most defect cases, the scaling relationship between l and d is linear, albeit with different slopes.
  • Keywords
    cellular automata; integrated logic circuits; majority logic; quantum gates; semiconductor quantum dots; Cartesian layout cell-to-cell spacing; QCA device manufacturing; QCA device scaling; binary wire; cell dimensions; cell size; defect characterization; displacement; inverter; majority voter; manufacturing processing variation sensitivity; misalignment; quantum dot cellular automata; CMOS technology; Electrons; Inverters; Lithography; Logic devices; Quantum cellular automata; Quantum computing; Quantum dots; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 2004. DFT 2004. Proceedings. 19th IEEE International Symposium on
  • ISSN
    1550-5774
  • Print_ISBN
    0-7695-2241-6
  • Type

    conf

  • DOI
    10.1109/DFTVS.2004.1347822
  • Filename
    1347822