Title :
Bipolar resistance switching in multiferroic BiFeO3 polycrystalline films
Author :
Yin, Kuibo ; Li, Mi ; Liu, Yiwei ; He, Congli ; Chen, Bin ; Wang, Jinzhi ; Zhuge, Fei ; Li, Run-Wei ; Cui, Ping ; Pan, Xiaoqing
Author_Institution :
Ningbo Inst. of Mater. Technol. & Eng. (NIMTE), Chinese Acad. of Sci. (CAS), Ningbo, China
Abstract :
Bismuth ferrite (BiFeO3) is an attractive multiferroic material. However, its application as a ferroelectric material in electronic devices is limited by large leakage current. In this letter, a bipolar resistance switching phenomenon was observed in BiFeO3 polycrystalline films prepared by sol-gel method. The resistance of a fresh film is in an intermediate state and can be transformed into either high-resistive or low-resistive states by applying an external voltage across the film. The I-V curves of the fresh film are nearly centrosymmetric before resistance switching. The resistance ratios between high- and low-resistance states are in the range of 2-3 orders of magnitude. The conductive atomic force microscopy measurements reveal that the grain boundaries are more conductive under a bias voltage of 10 V, and more resistive under 3 V than the grain interior. It was thought that grain boundaries and oxygen vacancies played a key role in the formation of bipolar resistance switching.
Keywords :
atomic force microscopy; bismuth compounds; ferroelectric materials; grain boundaries; leakage currents; multiferroics; sol-gel processing; vacancies (crystal); BiFeO3; bipolar resistance switching; bismuth ferrite; conductive atomic force microscopy; electronic devices; ferroelectric material; grain boundaries; leakage current; multiferroic material; multiferroic polycrystalline films; oxygen vacancies; sol-gel method; Atomic force microscopy; Atomic measurements; Bismuth; Ferrite films; Ferroelectric films; Ferroelectric materials; Force measurement; Grain boundaries; Leakage current; Voltage;
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
DOI :
10.1109/INEC.2010.5424655