Title :
Dynamic input match correction in RF low noise amplifiers
Author :
Das, Tejasvi ; Gopalan, Anand ; Washburn, Clyde ; Mukund, P.R.
Author_Institution :
Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
Abstract :
The input match of low noise amplifiers can degrade significantly due to process faults and the parasitic package inductances at its input pad. These inductances have wide tolerances and are difficult to co-design for. This paper presents a self-correction methodology that will go beyond BIST systems by ascertaining the input match frequency and dynamically re-aligning it, thus rendering the input match fault and package tolerant. The proposed two-tonal approach depends only on the difference of two signals that pass through the same sensing circuitry. Consequently, it is inherently insensitive to process, power supply and temperature variations. Coupled with the fact that the majority of the signal processing occurs in the baseband/DC domain, complexity and precision demands are highly lenient. We present simple, low-precision circuitry designed in IBM 0.25 μm CMOS RF process with low power and real-estate overheads, no DSP cores or processors and fast correction times of less than 30 μs. To the authors´ knowledge, this paper represents the first ever attempt at self correction of integrated RF front-end circuitry.
Keywords :
CMOS analogue integrated circuits; UHF amplifiers; UHF integrated circuits; error correction; fault tolerance; integrated circuit measurement; 0.25 micron; 30 mus; BIST systems; IBM CMOS RF process; RF low noise amplifiers; co-design; correction times; dynamic input match correction; dynamically re-aligned input match frequency; fault tolerant input match; inductance tolerances; input pad; integrated RF front-end circuitry self-correction; package tolerant input match; parasitic package inductances; power overheads; power supply variations; process faults; real-estate overheads; self-correction methodology; sensing circuitry; signal processing complexity; signal processing precision; temperature variations; two-tonal approach; Built-in self-test; Circuit faults; Degradation; Impedance matching; Low-noise amplifiers; Packaging; Power supplies; Radio frequency; Radiofrequency amplifiers; Temperature sensors;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 2004. DFT 2004. Proceedings. 19th IEEE International Symposium on
Print_ISBN :
0-7695-2241-6
DOI :
10.1109/DFTVS.2004.1347842