Title :
Non-intrusive test compression for SOC using embedded FPGA core
Author :
Zeng, Gang ; Ito, Hideo
Author_Institution :
Graduate Sch. of Sci. & Technol., Chiba Univ., Japan
Abstract :
In this paper, a complete non-intrusive test compression solution is proposed for system-on-a-chip (SOC) using embedded FPGA core. The solution achieves low-cost testing by employing not only selective Huffman vertical coding (SHVC) for test stimuli compression, but also MISR-based time compactor for test responses compaction. Moreover, the solution is non-intrusive, since it can tolerate any number of unknown states in output responses such that it does not require modifying the logic of core to eliminate or block the sources of unknown states. Furthermore, the solution obtains improved diagnostic capability over conventional MISR by combining masking logic with a modified MISR. Experimental results for ISCAS 89 benchmarks as well as a platform FPGA chip have proven the efficiency of the proposed test solution.
Keywords :
Huffman codes; data compression; fault diagnosis; field programmable gate arrays; integrated circuit testing; logic testing; system-on-chip; ISCAS 89 benchmarks; MISR-based time compactor; SHVC; SOC; diagnostic capability; embedded FPGA core; logic core; low-cost testing; masking logic; multiple input signature register; nonintrusive test compression; output responses; platform FPGA chip; selective Huffman vertical coding; system-on-a-chip; test responses compaction; test stimuli compression; unknown states; Benchmark testing; Built-in self-test; Compaction; Costs; Decoding; Field programmable gate arrays; Huffman coding; Logic testing; System testing; System-on-a-chip;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 2004. DFT 2004. Proceedings. 19th IEEE International Symposium on
Print_ISBN :
0-7695-2241-6
DOI :
10.1109/DFTVS.2004.1347866