• DocumentCode
    1662110
  • Title

    Interconnect modeling and design in high-speed VLSI/ULSI systems

  • Author

    Oh, Soo-Young ; Chang, Keh-Jeng ; Chang, Norman ; Lee, Ken

  • Author_Institution
    Hewlett Packard, Palo Alto, CA, USA
  • fYear
    1992
  • Firstpage
    184
  • Lastpage
    189
  • Abstract
    A batch-oriented interconnect modeling system, IPDA (Interconnect Performance Design Assistant), developed for interconnect modeling and design in high-speed VLSI/ULSI systems, is presented. Intrachip communication is degraded by RC delay and crosstalk, and electromigration generates a serious reliability problem. Several approaches for alleviating these problems are quantitatively analyzed, and optimum approaches are recommended. In the interchip communication, reflection, crosstalk, and simultaneous switching noise, degrade the system performance. Approaches for solving these problems are introduced and analyzed for practical applications
  • Keywords
    VLSI; integrated circuit technology; microprocessor chips; Interconnect Performance Design Assistant; RC delay; ULSI; VLSI; batch-oriented interconnect modeling system; crosstalk; electromigration; interchip communication; reflection; simultaneous switching noise; Degradation; Delay; Design optimization; Dielectric constant; Integrated circuit interconnections; Integrated circuit modeling; Numerical simulation; SPICE; Ultra large scale integration; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1992. ICCD '92. Proceedings, IEEE 1992 International Conference on
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-8186-3110-4
  • Type

    conf

  • DOI
    10.1109/ICCD.1992.276245
  • Filename
    276245