• DocumentCode
    1662249
  • Title

    Drastic reduction of chemical consumption in wet cleaning process for semiconductor manufacturing by using functional water

  • Author

    Kurobe, Hiroshi ; Morita, Hiroshi

  • Author_Institution
    Kurita Water Industries Ltd., Shinjuku-ku, Tokyo 160-8383, Japan, E-mail address: hiroshi.kurobe@kurita.co.jp
  • fYear
    2005
  • Firstpage
    590
  • Lastpage
    591
  • Abstract
    In cleaning processes of semiconductor manufacturing, a method called `RCA cleaning´ is used for a long time. We suggest `functional water cleaning´ as the first substituted method of RCA cleaning. Functional water for wet cleaning is water that specific gases are dissolved in, mainly hydrogenated water (H2-water) and ozonated water (O3-water). In this paper, we introduce cleaning effect, impact for cost reduction and ESH (Environment, Safety, Health) protection by using functional water.
  • Keywords
    H; O; RCA cleaning; functional water; Chemical industry; Chemical processes; Cleaning; Cost function; Manufacturing processes; Protection; Semiconductor device manufacture; Semiconductor impurities; Temperature; Water pollution; H; O; RCA cleaning; functional water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on
  • Print_ISBN
    1-4244-0081-3
  • Type

    conf

  • DOI
    10.1109/ECODIM.2005.1619303
  • Filename
    1619303