DocumentCode :
1662249
Title :
Drastic reduction of chemical consumption in wet cleaning process for semiconductor manufacturing by using functional water
Author :
Kurobe, Hiroshi ; Morita, Hiroshi
Author_Institution :
Kurita Water Industries Ltd., Shinjuku-ku, Tokyo 160-8383, Japan, E-mail address: hiroshi.kurobe@kurita.co.jp
fYear :
2005
Firstpage :
590
Lastpage :
591
Abstract :
In cleaning processes of semiconductor manufacturing, a method called `RCA cleaning´ is used for a long time. We suggest `functional water cleaning´ as the first substituted method of RCA cleaning. Functional water for wet cleaning is water that specific gases are dissolved in, mainly hydrogenated water (H2-water) and ozonated water (O3-water). In this paper, we introduce cleaning effect, impact for cost reduction and ESH (Environment, Safety, Health) protection by using functional water.
Keywords :
H; O; RCA cleaning; functional water; Chemical industry; Chemical processes; Cleaning; Cost function; Manufacturing processes; Protection; Semiconductor device manufacture; Semiconductor impurities; Temperature; Water pollution; H; O; RCA cleaning; functional water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on
Print_ISBN :
1-4244-0081-3
Type :
conf
DOI :
10.1109/ECODIM.2005.1619303
Filename :
1619303
Link To Document :
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