Title :
Measurements of millimeter wave test structures for high speed chip testing
Author :
De Keulenaer, T. ; Yu Ban ; Torfs, G. ; Sercu, Stefaan ; De Geest, Jan ; Bauwelinck, J.
Author_Institution :
INTEC/IMEC, Ghent Univ., Ghent, Belgium
Abstract :
This paper presents the frequency domain characterization of very high bandwidth connectorized traces and a millimeter wave rat race coupler. These connectorized differential grounded coplanar waveguide traces, essential for the testability of high speed integrated circuits, have a measured flat frequency response up to 67 GHz which indicates correct connector footprint and transmission line design. The differential traces narrow down to a chip scale pitch of 150 μm allowing direct flip chip connections. This enabling the testing of millimeter wave integrated circuits without the need for probing. Furthermore, a 50 GHz rat race coupler was fabricated to generate a differential clock from a single ended clock source.
Keywords :
coplanar waveguides; flip-chip devices; frequency response; high-speed integrated circuits; integrated circuit testing; millimetre wave integrated circuits; transmission lines; waveguide couplers; chip scale pitch; connectorized differential grounded coplanar waveguide traces; correct connector footprint; differential clock; direct flip chip connections; flat frequency response; frequency 50 GHz; frequency domain characterization; high speed chip testing; high speed integrated circuits; millimeter wave integrated circuits; millimeter wave rat race coupler; millimeter wave test structures measurements; single ended clock source; size 150 mum; transmission line design; very high bandwidth connectorized traces; Bandwidth; Connectors; Couplers; Impedance; Materials; Semiconductor device measurement; Transmission line measurements;
Conference_Titel :
Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on
Conference_Location :
Ghent
DOI :
10.1109/SaPIW.2014.6844529