Title :
Analytical approach of saturation voltage instability in high-speed IGBT
Author :
Kaneda, Mitsuru ; Tadokoro, Chihiro ; Kiyoi, Akira ; Kusunoki, Shigeru ; Kurokawa, Hiroshi
Author_Institution :
Mitsubishi Electr. Corp., Fukuoka, Japan
Abstract :
A High speed IGBT utilizing an Electron Beam (EB) irradiation and a post annealing process for a carrier lifetime control for a thick n-drift layer has been developed for industry applications, and home appliance especially in the very small chip size to achieve a low cost and a minimizing a size requirements. Even under the extremely high current density of around a half order of higher than the conventional usage for long-time production life, stability of both a saturation voltage VCE(sat), on state forward voltage drop, and a turn off losses Eoff are needed from a reliability point of view. We investigated dependences on the carrier lifetime control processes and a conduction current stress condition by both the IGBT electrical characteristics stability, i.e. for ward out put I-V characteristics, switching characteristics, threshold voltage, and leakage current, and a physical analysis using the Cathode Luminescence (CL) method. And we confirmed that shifts of electrical characteristics are very slight without any problem to use in the relatively high current density operation. Only for the acceleration case, an obvious CL spectrum change can be observed and to be assigned each trap level.
Keywords :
insulated gate bipolar transistors; power semiconductor devices; semiconductor device reliability; carrier lifetime control; cathode luminescence method; conduction current stress condition; electron beam irradiation; forward output I-V characteristics; high-speed IGBT; leakage current; saturation voltage instability; switching characteristics; threshold voltage; Annealing; Charge carrier lifetime; Current density; Electric variables; Electron beams; Industry applications; Insulated gate bipolar transistors; Size control; Thickness control; Voltage; Device characterization; IGBT; Reliability;
Conference_Titel :
Power Electronics and Applications, 2009. EPE '09. 13th European Conference on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4244-4432-8
Electronic_ISBN :
978-90-75815-13-9