DocumentCode
166285
Title
Analysis of wave propagation along coaxial through silicon vias using a matrix method
Author
Dahl, David ; Beyreuther, Anne ; Xiaomin Duan ; Ndip, Ivan ; Lang, K.-D. ; Schuster, Christian
Author_Institution
Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg (TUHH), Hamburg, Germany
fYear
2014
fDate
11-14 May 2014
Firstpage
1
Lastpage
4
Abstract
This paper presents an efficient method for the determination of the dispersion relation of wave propagation along coaxial structures with radially layered dielectric filling based on a matrix method known from the theory of optical waveguides. The method is applied for investigations of coaxial through silicon vias having different dimensions and different conductivities of the silicon semiconductor filling. The fundamental modes are derived, results are correlated to full-wave simulation results, and the physical phenomena of quasi TEM, slow-wave and skin-effect propagation in the fundamental mode are discussed with regard to signal integrity.
Keywords
coaxial waveguides; electromagnetic wave propagation; matrix algebra; optical waveguide theory; three-dimensional integrated circuits; coaxial structures; dispersion relation; full-wave simulation results; matrix method; optical waveguides theory; quasi TEM propagation; radially layered dielectric filling; signal integrity; silicon semiconductor filling; silicon vias; skin-effect propagation; slow-wave propagation; Approximation methods; Conductivity; Conductors; Dielectrics; Silicon; Silicon compounds; Transmission line matrix methods; 3D interconnects; matrix method; multilayer coaxial waveguides; through silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on
Conference_Location
Ghent
Type
conf
DOI
10.1109/SaPIW.2014.6844539
Filename
6844539
Link To Document